The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Aug. 08, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chin-Hsiung Hsu, Guyanyin Township, TW;

Huang-Yu Chen, Zhudong Township, Hsinchu County, TW;

Tsong-Hua Ou, Taipei, TW;

Wen-Hao Chen, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); G03F 1/70 (2012.01); G03F 7/20 (2006.01); G06F 30/39 (2020.01); H01L 21/3213 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
G03F 7/2022 (2013.01); G03F 1/70 (2013.01); G06F 30/39 (2020.01); H01L 21/3213 (2013.01); H05K 3/0082 (2013.01); H05K 3/06 (2013.01); H05K 3/0005 (2013.01); H05K 3/068 (2013.01); H05K 2201/09781 (2013.01); H05K 2203/0557 (2013.01); H05K 2203/1476 (2013.01); Y10T 29/49156 (2015.01);
Abstract

A method includes: providing a first layout of a first layer over a substrate, the first layer having at least one metal pattern, and generating a second layout by placing a cut mask at a first position relative to the substrate to remove material from a first region of the at least one metal pattern to provide a first metal pattern and placing the cut mask at a second position relative to the first layer over the substrate to remove material from a second region of the at least one metal pattern to provide a second metal pattern.


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