The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Apr. 22, 2020
Applicant:

Innoscience (Zhuhai) Technology Co., Ltd., Zhuhai, CN;

Inventors:

Anbang Zhang, Zhuhai, CN;

King Yuen Wong, Zhuhai, CN;

Hao Li, Zhuhai, CN;

Haoning Zheng, Zhuhai, CN;

Jian Wang, Zhuhai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 29/10 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/41766 (2013.01); H01L 29/1029 (2013.01); H01L 29/2003 (2013.01); H01L 29/41725 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 29/7838 (2013.01);
Abstract

A semiconductor device and a method for manufacturing the same are provided in this disclosure. The semiconductor device includes a semiconductor heterostructure layer. The semiconductor heterostructure layer includes alternating first semiconductor material layers and second semiconductor material layers. Two-dimensional hole gas (2DHG) may be generated between each first semiconductor material layer and adjacent second semiconductor material layer. A conductive structure, including a plurality of conductive fingers extends from a surface of the semiconductor heterostructure layer into the semiconductor heterostructure layer. The plurality of conductive fingers are arranged in a direction substantially parallel to the surface. The lengths of the plurality of conductive fingers progressively increase in that direction so that an end portion of each conductive finger is respectively positioned in a different first semiconductor material layer and is in contact with the 2DHG.


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