The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Dec. 23, 2020
Intel Corporation, Santa Clara, CA (US);
Zhen Zhou, Chandler, AZ (US);
Tae Young Yang, Portland, OR (US);
Tolga Acikalin, San Jose, CA (US);
Johanny Escobar Pelaez, Zapopan, MX;
Kenneth P. Foust, Beaverton, OR (US);
Chia-Pin Chiu, Tempe, OR (US);
Renzhi Liu, Portland, OR (US);
Cheng-Yuan Chin, Las Vegas, NV (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.