The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Nov. 30, 2021
Applicant:
Tanaka Denshi Kogyo K. K., Saga, JP;
Inventors:
Mitsuo Takada, Saga, JP;
Nanako Maeda, Saga, JP;
Osamu Matsuzawa, Saga, JP;
Ryo Ishikawa, Saga, JP;
Takuya Kobayashi, Saga, JP;
Assignee:
TANAKA DENSHI KOGYO K. K., Kanzaki-gun, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C22C 9/00 (2006.01); C22F 1/08 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); C22C 9/00 (2013.01); C22F 1/08 (2013.01); H01L 24/43 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); C22C 2204/00 (2013.01); H01L 23/49805 (2013.01); H01L 23/49816 (2013.01); H01L 2224/4321 (2013.01); H01L 2224/43825 (2013.01); H01L 2224/43848 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45572 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48453 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/85045 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A palladium-coated copper bonding wire includes: a core material containing copper as a main component; and a palladium layer on the core material, in which a concentration of palladium relative to the entire wire is 1.0 mass % or more and 4.0 mass % or less, and a work hardening coefficient in an amount of change of an elongation rate 2% or more and a maximum elongation rate ε max % or less of the wire, is 0.20 or less.