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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11996382 B1

PDFFull Text
Date of Patent:
May. 28, 2024

Filed:

Nov. 30, 2021

Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof

Applicant:

Tanaka Denshi Kogyo K. K., Saga, JP;

Inventors:

Mitsuo Takada, Saga, JP;

Nanako Maeda, Saga, JP;

Osamu Matsuzawa, Saga, JP;

Ryo Ishikawa, Saga, JP;

Takuya Kobayashi, Saga, JP;

Assignee:

TANAKA DENSHI KOGYO K. K., Kanzaki-gun, JP;

Attorneys:

ORRICK, HERRINGTON & SUTCLIFFE LLP

K. Patrick Herman

Richard Martinelli

Primary Examiner:

Ajay Arora

Int. Cl.
CPC ...
H01L 23/00 (2006.01); C22C 9/00 (2006.01); C22F 1/08 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); C22C 9/00 (2013.01); C22F 1/08 (2013.01); H01L 24/43 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); C22C 2204/00 (2013.01); H01L 23/49805 (2013.01); H01L 23/49816 (2013.01); H01L 2224/4321 (2013.01); H01L 2224/43825 (2013.01); H01L 2224/43848 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45572 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48453 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/85045 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A palladium-coated copper bonding wire includes: a core material containing copper as a main component; and a palladium layer on the core material, in which a concentration of palladium relative to the entire wire is 1.0 mass % or more and 4.0 mass % or less, and a work hardening coefficient in an amount of change of an elongation rate 2% or more and a maximum elongation rate ε max % or less of the wire, is 0.20 or less.

Find Patent Forward Citations

Takada, Mitsuo. (2024). Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof (U.S. Patent No. 11996382). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11996382

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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