The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Mar. 29, 2022
Applicant:

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, CN;

Inventors:

Gang-Yi Lin, Quanzhou, CN;

Yu-Cheng Tung, Quanzhou, CN;

Yi-Wang Jhan, Quanzhou, CN;

Yifei Yan, Quanzhou, CN;

Xiaopei Fang, Quanzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/033 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0338 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01); H01L 21/76892 (2013.01); H01L 23/528 (2013.01);
Abstract

A semiconductor structure, including a plurality of connection patterns disposed on the substrate, and a merged pattern disposed between adjacent two of the connection patterns, wherein the merged pattern includes a first outer line, a central line and a second outer line sequentially arranged along a first direction and connected with each other, and an end surface of the first outer line, an end surface of the central line and an end surface of the second outer line are misaligned along the first direction.


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