The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Oct. 02, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Shuangqiang Luo, Boise, ID (US);

Indra V. Chary, Boise, ID (US);

Justin B. Dorhout, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/27 (2023.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 23/535 (2006.01); H10B 41/27 (2023.01);
U.S. Cl.
CPC ...
H10B 43/27 (2023.02); H01L 21/76805 (2013.01); H01L 21/76895 (2013.01); H01L 23/53242 (2013.01); H01L 23/535 (2013.01); H01L 23/562 (2013.01); H10B 41/27 (2023.02);
Abstract

A microelectronic device may include a stack structure comprising a vertically alternating sequence of insulative structures and conductive structures, the stack structure divided into block portions. The microelectronic device may additionally include slit structures horizontally interposed between the block portions of the stack structure. Each of the slit structures may include a dielectric liner covering side surfaces of the stack structure and an upper surface of an additional structure underlying the stack structure, and a plug structure comprising at least one metal surrounded by the dielectric liner.


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