The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Jun. 24, 2015
Applicant:
Entegris, Inc., Billerica, MA (US);
Inventors:
Lingyan Song, Danbury, CT (US);
Steven Lippy, Brookfield, CT (US);
Emanuel I. Cooper, Scarsdale, NY (US);
Assignee:
ENTEGRIS, INC., Billerica, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 3/08 (2006.01); C11D 1/00 (2006.01); C11D 1/66 (2006.01); C11D 3/04 (2006.01); C11D 3/24 (2006.01); C11D 3/30 (2006.01); C11D 3/36 (2006.01); C11D 3/37 (2006.01); C11D 3/43 (2006.01); C11D 7/08 (2006.01); C11D 7/10 (2006.01); C11D 7/28 (2006.01); C11D 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02068 (2013.01); B08B 3/08 (2013.01); C11D 1/008 (2013.01); C11D 1/667 (2013.01); C11D 3/042 (2013.01); C11D 3/046 (2013.01); C11D 3/245 (2013.01); C11D 3/30 (2013.01); C11D 3/361 (2013.01); C11D 3/3707 (2013.01); C11D 3/43 (2013.01); C11D 7/08 (2013.01); C11D 7/10 (2013.01); C11D 7/28 (2013.01); C11D 11/0047 (2013.01); H01L 21/02063 (2013.01);
Abstract
Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and/or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and/or capping layers also present thereon.