The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Jul. 21, 2022
Applicant:
Fujimi Incorporated, Kiyosu, JP;
Inventors:
Kohsuke Tsuchiya, Kiyosu, JP;
Hisanori Tansho, Kiyosu, JP;
Yusuke Suga, Kiyosu, JP;
Taiki Ichitsubo, Kiyosu, JP;
Takayuki Takemoto, Nagoya, JP;
Naohiko Saito, Nagoya, JP;
Michihiro Kaai, Nagoya, JP;
Assignee:
FUJIMI INCORPORATED, Kiyosu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 37/04 (2012.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/044 (2013.01); H01L 21/30625 (2013.01);
Abstract
Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.