The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Nov. 05, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Takeshi Kobayashi, Iwate, JP;

Tatsuo Matsudo, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 11/00 (2006.01); C23C 16/458 (2006.01); C23C 16/50 (2006.01); C23C 16/52 (2006.01); G01B 11/06 (2006.01); H01J 37/244 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/244 (2013.01); C23C 16/4584 (2013.01); C23C 16/50 (2013.01); C23C 16/52 (2013.01); G01B 11/0616 (2013.01); G01K 11/00 (2013.01); H01J 37/32715 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/332 (2013.01);
Abstract

A temperature measurement system includes: a thickness calculating unit that calculates an optical thickness of a substrate; a rotation position detecting unit that detects rotation position information of the rotary table; a substrate specifying unit that specifies a substrate based on the rotation position information; a storage unit that stores first relationship information indicating a relationship between a temperature and a thickness associated with each substrate, and second relationship information indicating a relationship between an amount of change in temperature and an amount of change in optical thickness associated with each substrate; and a temperature calculating unit that calculates a temperature of the substrate based on the optical thickness calculated by the thickness calculating unit, the substrate specified by the substrate specifying unit, the first relationship information, and the second relationship information.


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