The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Jul. 30, 2018
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Liran Yerushalmi, Zicron Yaacob, IL;

Roie Volkovich, Hadera, IL;

Assignee:

KLA-TENCOR CORPORATION, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G01B 11/27 (2006.01); H01L 21/68 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G01B 11/272 (2013.01); G03F 7/70683 (2013.01); G03F 7/706835 (2023.05); H01L 21/681 (2013.01); H01L 23/544 (2013.01); G01B 2210/56 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01);
Abstract

Process control methods, metrology targets and production systems are provided for reducing or eliminating process overlay errors. Metrology targets have pair(s) of periodic structures with different segmentations, e.g., no segmentation in one periodic structure and device-like segmentation in the other periodic structure of the pair. Process control methods derive metrology measurements from the periodic structures at the previous layer directly following the production thereof, and prior to production of the periodic structures at the current layer, and use the derived measurements to adjust lithography stage(s) that is part of production of the current layer. Production system integrate lithography tool(s) and metrology tool(s) into a production feedback loop that enables layer-by-layer process adjustments.


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