The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2024
Filed:
Mar. 17, 2020
Fujian Jinhua Integrated Circuit Co., Ltd., Fujian, CN;
Yi-Wang Jhan, Fujian, CN;
Yung-Tai Huang, Fujian, CN;
Xin You, Fujian, CN;
Xiaopei Fang, Fujian, CN;
Yu-Cheng Tung, Fujian, CN;
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD., Quanzhou, CN;
Abstract
A semiconductor structure and a method of fabricating therefor are disclosed. A second contact pad () is arranged lateral to a first contact pad () in an interconnect structure (). As a result, during fabrication of the interconnect structure (), the first contact pad () will not be present alone in a large bland area, due to the presence of the second contact pad (). Thus, a pattern feature for the first contact pad () will not be over-resolved, increasing formation accuracy of the first contact pad () and thus guaranteeing good electrical transmission performance of the resulting interconnect structure ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile