The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Aug. 17, 2021
Applicant:

Kla Corporation, Milpitas, CA (US);

Inventors:

Narayani Narasimhan, New Delhi, IN;

Alán Dávila, Pflugerville, TX (US);

P. Jithendra Kumar Reddy, Hyderabad, IN;

Ski Sim, Singapore, SG;

Osamu Yamamoto, Kanagawa, JP;

Assignee:

KLA CORPORATION, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A wafer map is classified using the machine learning based model and a signature on the wafer map. The machine learning based model uses transfer learning. The machine learning based model can be trained using images from various sources that are extracted and augmented and their features extracted. These extracted features can be classified into defects that occur during semiconductor manufacturing.


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Narasimhan, Narayani. (2024). Wafer level spatial signature grouping using transfer learning (U.S. Patent No. 11967060). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11967060

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