The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Sep. 21, 2020
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Huanlong Liu, Sunnyvale, CA (US);
Guenole Jan, San Jose, CA (US);
Ru-Ying Tong, Los Gatos, CA (US);
Jian Zhu, San Jose, CA (US);
Yuan-Jen Lee, Fremont, CA (US);
Jodi Mari Iwata, San Carlos, CA (US);
Sahil Patel, Fremont, CA (US);
Vignesh Sundar, Fremont, CA (US);
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A fabrication process for an STT MTJ MRAM device includes steps of cooling the device at individual or at multiple stages in its fabrication. The cooling process, which may be equally well applied during the fabrication of other multi-layered devices, is demonstrated to produce an operational device that is more resistant to adverse thermal effects during operation that would normally cause a similar device not so fabricated to lose stored data and otherwise fail to operate properly.