The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Jul. 26, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sipeng Gu, Clifton Park, NY (US);

Baonian Guo, Andover, MA (US);

Qintao Zhang, Mt Kisco, NY (US);

Wei Zou, Lexington, MA (US);

Kyuha Shim, Andover, MA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/28 (2006.01); H01L 21/3215 (2006.01); H01L 21/3213 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66545 (2013.01); H01L 21/28132 (2013.01); H01L 21/32155 (2013.01); H01L 29/66742 (2013.01); H01L 21/32139 (2013.01); H01L 29/0673 (2013.01); H01L 29/42392 (2013.01); H01L 29/66553 (2013.01); H01L 29/78696 (2013.01);
Abstract

Approaches herein decrease nanosheet gate length variations by implanting a gate layer material with ions prior to etching. A method may include forming a dummy gate structure over a nanosheet stack, the dummy gate structure including a hardmask atop a gate material layer, and removing a portion of the hardmask to expose a first area and a second area of the gate material layer. The method may further include implanting the dummy gate structure to modify the first and second areas of the gate material layer, and etching the first and second areas of the gate material layer to form a treated layer along a sidewall of a third area of the gate material layer, wherein the third area is beneath the hardmask.


Find Patent Forward Citations

Loading…