The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Dec. 17, 2021
Applicant:

Globalfoundries U.s. Inc., Malta, NY (US);

Inventors:

Meng Miao, Williston, VT (US);

Alain Loiseau, Williston, VT (US);

Souvick Mitra, Essex Junction, VT (US);

Wei Liang, South Burlington, VT (US);

Robert J. Gauthier, Jr., Williston, VT (US);

Anindya Nath, Essex Junction, VT (US);

Assignee:

GlobalFoundries U.S. Inc., Malta, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 27/12 (2006.01); H01L 29/74 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0248 (2013.01); H01L 27/1207 (2013.01); H01L 29/7436 (2013.01);
Abstract

Disclosed are embodiments of a semiconductor structure that includes a semiconductor-controlled rectifier (e.g., for electrostatic discharge (ESD) protection). The SCR can be readily integrated into advanced semiconductor-on-insulator processing technology platforms (e.g., a fully depleted silicon-on-insulator (FDSOI) processing technology platform) that employ hybrid semiconductor substrates (i.e., semiconductor substrates with both bulk semiconductor and semiconductor-on-insulator regions) and is configured with an on-Pwell semiconductor-on-insulator gate structure that is tied to an anode terminal to effectively lower the SCR trigger voltage. To further lower the trigger voltage of the SCR, the Pwell on which the gate structure sits may be made narrower than the gate structure and/or the doping profile of the Pwell on which the gate structure sits may be graded (e.g., P to P− closer to insulator layer). Additionally, to minimize parasitic capacitance, the gate structure may be shorter in length than contact regions parallel and adjacent thereto.


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