The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Jan. 13, 2021
Applicant:

Beijing Naura Microelectronics Equipment Co., Ltd., Beijing, CN;

Inventors:

Liren Han, Beijing, CN;

Bing Li, Beijing, CN;

Keke Zhao, Beijing, CN;

Lixin Pei, Beijing, CN;

Guodong Bian, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/04 (2006.01); C23C 14/34 (2006.01); C23C 14/50 (2006.01); C23C 14/54 (2006.01);
U.S. Cl.
CPC ...
C23C 14/042 (2013.01); C23C 14/34 (2013.01); C23C 14/50 (2013.01); C23C 14/541 (2013.01);
Abstract

The present disclosure provides a sputtering reaction chamber and a process assembly of the sputtering reaction chamber. The process assembly includes a liner, and the liner includes an integrally formed body member and a cover member. The cover member may extend from a bottom of the body member to an inner side of the body member and may be configured to press an edge of a to-be-processed workpiece when a process is performed. A cooling channel may be arranged in the cover member and the body member and may be configured to cool the cover member and the body member by transferring coolant. The process assembly of the sputtering reaction chamber and the sputtering reaction chamber provided by the present disclosure can reduce heat radiation of the process assembly to the to-be-processed workpiece and released gases and impurities to effectively reduce a whisker defect and improve a product yield.


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