The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Nov. 30, 2020
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Yasuhiro Uchimura, Yokkaichi, JP;

Tatsufumi Hamada, Nagoya, JP;

Shinichi Sotome, Yokkaichi, JP;

Tomohiro Kuki, Yokkaichi, JP;

Yasunori Oshima, Yokkaichi, JP;

Osamu Arisumi, Kuwana, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/10 (2023.01); G11C 11/56 (2006.01); G11C 16/08 (2006.01); G11C 16/24 (2006.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01);
U.S. Cl.
CPC ...
H10B 43/10 (2023.02); G11C 11/5642 (2013.01); G11C 16/08 (2013.01); G11C 16/24 (2013.01); H10B 43/27 (2023.02); H10B 43/35 (2023.02);
Abstract

According to one embodiment, a memory device includes a substrate; a structure including a plurality of conductive layers stacked on the substrate; and a pillar arranged inside the structure and including a semiconductor layer that extends in a direction perpendicular to a surface of the substrate. The semiconductor layer includes a first portion on a side of an upper portion of the structure, and a second portion between the first portion and the substrate. The first portion has a thickness larger than a thickness of the second portion.


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