The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Jul. 08, 2021
Sandisk Technologies Llc, Addison, TX (US);
Lin Hou, Leuven, BE;
Peter Rabkin, Cupertino, CA (US);
Adarsh Rajashekhar, Santa Clara, CA (US);
Raghuveer S. Makala, Campbell, CA (US);
Masaaki Higashitani, Cupertino, CA (US);
SANDISK TECHNOLOGIES LLC, Addison, TX (US);
Abstract
A bonded assembly includes a first semiconductor die containing a first substrate, first semiconductor devices, and first bonding pads laterally surrounded by a first pad-level dielectric layer. The first pad-level dielectric layer includes at least one first encapsulated airgap located between neighboring pairs of first bonding pads and encapsulated by a first dielectric fill material of the first pad-level dielectric layer. The bonded assembly includes a second semiconductor die containing a second substrate, second semiconductor devices, and second bonding pads laterally surrounded by a second pad-level dielectric layer. Each of the second bonding pads is bonded to a respective one of the first bonding pads.