The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Jul. 26, 2023
Applicant:

Unity Semiconductor, Montbonnot-Saint-Martin, FR;

Inventors:

Dario Alliata, Montbonnot-Saint-Martin, FR;

Jean-François Boulanger, Montbonnot-Saint-Martin, FR;

Assignee:

Unity Semiconductor, Montbonnot-Saint-Martin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G01N 21/9501 (2013.01); H01L 22/20 (2013.01);
Abstract

A measurement system and an inspection method for detecting a defective bonding interface in a sample substrate including at least one element disposed on a support. The method comprises: placing the sample substrate in the measurement system, establishing an inclination map of the exposed surface, analyzing the inclination map and identifying a zone or zones of the exposed surface whose inclinations deviate by more than a given threshold from the inclination of the reference surface; and detecting the presence of a defective bond between the element and the support, depending on the result of the analysis of the inclination map.


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