The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Jan. 29, 2021
Applicant:

Advanced Ion Beam Technology, Inc., Hsin-Chu, TW;

Inventors:

Chien-Li Chen, Hsin-Chu, TW;

Steven R. Walther, Hsin-Chu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 14/48 (2006.01); C23C 14/54 (2006.01); G01B 7/06 (2006.01); G01B 11/08 (2006.01); G01K 3/00 (2006.01); G01S 7/481 (2006.01); G01S 17/08 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); C23C 14/48 (2013.01); C23C 14/541 (2013.01); G01B 7/08 (2013.01); G01B 11/08 (2013.01); G01K 3/005 (2013.01); G01S 7/4814 (2013.01); G01S 17/08 (2013.01); H01L 21/265 (2013.01); H01L 21/324 (2013.01); H01L 21/67115 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01);
Abstract

The present disclosure relates generally to ion implantation, and more particularly, to systems and processes for measuring the temperature of a wafer within an ion implantation system. An exemplary ion implantation system may include a robotic arm, one or more load lock chambers, a pre-implantation station, an ion implanter, a post-implantation station, and a controller. The pre-implantation station is configured to heat or cool a wafer prior to the wafer being implanted with ions by the ion implanter. The post-implantation station is configured to heat or cool a wafer after the wafer is implanted with ions by the ion implanter. The pre-implantation station and/or post-implantation station are further configured to measure a current temperature of a wafer. The controller is configured to control the various components and processes described above, and to determine a current temperature of a wafer based on information received from the pre-implantation station and/or post-implantation station.


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