The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Jan. 30, 2020
Fujimi Incorporated, Kiyosu, JP;
FUJIMI INCORPORATED, Kiyosu, JP;
Abstract
The present invention provides means capable of achieving both a reduction in the number of defects and a reduction in haze in an object to be polished after polishing at a high level in a method of polishing the object to be polished containing a material having a silicon-silicon bond. The present invention relates to a method of polishing an object to be polished containing a material having a silicon-silicon bond, and the polishing method includes a final polishing step P. In this polishing method, the final polishing step Phas a plurality of polishing sub-steps, the plurality of polishing sub-steps are continuously performed on the same polishing platen, a final polishing sub-step in the plurality of polishing sub-steps is a polishing sub-step Pof polishing using a polishing composition S, a polishing sub-step provided before the polishing sub-step Pin the plurality of polishing sub-steps is a polishing sub-step Pof polishing using a polishing composition S, and the polishing composition Ssatisfies at least one of the following condition (A) or the following condition (B): condition (A): a value of a haze parameter of the polishing composition Sobtained in a standard test 1 is smaller than a value of the haze parameter of the polishing composition Sobtained in the standard test 1, and condition (B): the polishing composition Scontains an abrasive A, a basic compound B, and hydroxyethyl cellulose.