The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2024

Filed:

Aug. 28, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Pin Chi Huang, Hsinchu, TW;

Chien-Chang Fang, Fongshan, TW;

Rung Hung Hsueh, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76865 (2013.01); H01L 21/0217 (2013.01); H01L 21/0245 (2013.01); H01L 21/02458 (2013.01); H01L 21/76832 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

A semiconductor device includes a gate structure on a substrate and a dielectric film stack over the gate structure and the substrate, where the dielectric film stack includes a first inter layer dielectric (ILD) over the substrate and the gate structure, a barrier layer over the first ILD, a second ILD over the barrier layer, and a contact extending through the dielectric film stack. An upper portion of a contact sidewall has a first slope, a lower portion of the contact sidewall has a second slope different from the first slope, and a transition from the first slope to the second slope occurs at a portion of the contact extending through the barrier layer.


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Huang, Pin. (2024). Barrier structure for semiconductor device (U.S. Patent No. 11929283). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11929283

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