The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Jul. 21, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Yin-Kai Liao, Taipei, TW;
Sin-Yi Jiang, Hsinchu, TW;
Hsiang-Lin Chen, Hsinchu, TW;
Yi-Shin Chu, Hsinchu, TW;
Po-Chun Liu, Hsinchu, TW;
Kuan-Chieh Huang, Hsinchu, TW;
Jyh-Ming Hung, Dacun Township, TW;
Jen-Cheng Liu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material. The second semiconductor material is a group IV semiconductor or a group III-V compound semiconductor. A passivation layer is disposed on the second semiconductor material. The passivation layer includes the first semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material.