The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Dec. 17, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Takashi Nakazawa, Kumamoto, JP;

Isamu Miyamoto, Kumamoto, JP;

Keigo Satake, Kumamoto, JP;

Kenji Nakamizo, Kumamoto, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/26 (2006.01); C23F 1/08 (2006.01);
U.S. Cl.
CPC ...
C23F 1/26 (2013.01); C23F 1/08 (2013.01);
Abstract

A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.


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