The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Aug. 31, 2021
Disco Corporation, Tokyo, JP;
Asahi Nomoto, Tokyo, JP;
Kazuya Hirata, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer having a first surface, an opposite second surface, and an outer circumferential surface that includes a curved part curved outward in a protruding manner is separated into two wafers. Part of the wafer is removed along the curved part, and a separation origin is formed inside the wafer by positioning the focal point of a laser beam with a wavelength having transmissibility with respect to the wafer inside the wafer and executing irradiation with the laser beam while the focal point and the wafer are relatively moved in such a manner that the focal point is kept inside the wafer. The wafer is separated into two wafers by an external force.