The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Aug. 07, 2020
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Naoya Shimoju, Haibara-gun, JP;

Akinori Shibuya, Haibara-gun, JP;

Yuichiro Goto, Haibara-gun, JP;

Akihiro Hakamata, Haibara-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); C08F 220/28 (2006.01); C08F 220/30 (2006.01); B29C 59/02 (2006.01); B29C 59/16 (2006.01); G03F 7/11 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 59/02 (2013.01); B29C 59/16 (2013.01); C08F 220/283 (2020.02); C08F 220/303 (2020.02); G03F 7/11 (2013.01); G03F 7/161 (2013.01);
Abstract

Provided is a kit including a curable composition for imprinting which contains a polymerizable compound having an aromatic ring and a composition for forming an underlayer film for imprinting which contains a polymer and a solvent, in which the polymer contains at least one kind of specific constitutional unit and has a polymerizable group, a film formed of the composition for forming an underlayer film for imprinting is a solid film at 23° C., and a portion that has a continuous partial structure containing an aromatic ring which is included in the polymerizable compound and accounts for 60% by mass or more of the polymerizable compound is common to a continuous partial structure containing an aromatic ring which is included in a substituent R in a side chain in the polymer. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting which is used in combination with a curable composition for imprinting; a laminate; a method for producing a laminate; a method for producing a cured product pattern; and a method for manufacturing a circuit board.


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