The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Feb. 02, 2021
Changxin Memory Technologies, Inc., Anhui, CN;
Cheng-Jer Yang, Hefei, CN;
Changxin Memory Technologies, Inc., Hefei, CN;
Abstract
An integrated circuit with a through-silicon via (TSV) fault-tolerant circuit, a TSV fault tolerance method are disclosed. The IC may include a plurality of operational TSVs, a spare TSV, a plurality of fault-tolerance control modules each coupled to one of the plurality of operational TSVs and the spare TSV, and a decoder coupled to the fault-tolerance control modules. The fault-tolerance control modules may be configured to deactivate an operational TSV that is determined to be defective and activate the spare TSV based on a positioning code for the defective operational TSV from the decoder. The IC may reduce the defect rate in the fabrication of TSV-based three-dimensional (3D) IC chips.