The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Mar. 01, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kemal Aygun, Tempe, AZ (US);

Zhiguo Qian, Chandler, AZ (US);

Jianyong Xie, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/762 (2006.01); H01L 25/065 (2023.01); H01L 29/06 (2006.01); H01L 21/765 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/765 (2013.01); H01L 21/76283 (2013.01); H01L 25/0655 (2013.01); H01L 29/0649 (2013.01);
Abstract

An apparatus is provided which comprises: a substrate, the substrate comprising crystalline material, a first set of one or more contacts on a first substrate surface, a second set of one or more contacts on a second substrate surface, the second substrate surface opposite the first substrate surface, a first via through the substrate coupled with a first one of the first set of contacts and with a first one of the second set of contacts; a second via through the substrate coupled with a second one of the first set of contacts and with a second one of the second set of contacts, a trench in the substrate from the first substrate surface toward the second substrate surface, wherein the trench is apart from, and between, the first via and the second via, and dielectric material filling the trench. Other embodiments are also disclosed and claimed.


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