The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2024
Filed:
Oct. 31, 2019
Applicants:
Tokyo Electron Limited, Tokyo, JP;
Daikin Industries, Ltd., Osaka, JP;
Inventors:
Takashi Fuse, Yamanashi, JP;
Takashi Namikawa, Osaka, JP;
Assignees:
TOKYO ELECTRON LIMITED, Tokyo, JP;
DAIKIN INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/00 (2006.01); C09D 171/00 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
C09D 171/00 (2013.01); B05D 1/60 (2013.01); H01L 21/0271 (2013.01);
Abstract
A film forming method is a method of forming a film on a substrate top face including a first region in which a metal or a semiconductor is exposed and a second region in which an insulator is exposed. The method includes a SAM forming process of forming a self-assembled monolayer film of a perfluoropolyether group-containing compound on the first region and a film growth process of forming a predetermined film on the second region after execution of SAM forming process.