The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Sep. 27, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Georg Seidemann, Landshut, DE;

Sonja Koller, Regensburg, DE;

Bernd Waidhas, Pettendorf, DE;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3436 (2013.01); H01L 23/49816 (2013.01);
Abstract

A printed wiring-board island relieves added complexity to a printed circuit board. The printed wiring-board island creates an island form factor in the printed circuit board. Coupling of a semiconductive device package to the printed wiring-board island includes a ball-grid array. The ball-grid array can at least partially penetrate the printed wiring-board island.


Find Patent Forward Citations

Seidemann, Georg. (2024). Printed wiring-board islands for connecting chip packages and methods of assembling same (U.S. Patent No. 11877403). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11877403

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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