The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Sep. 24, 2021
Tokyo Electron Limited, Tokyo, JP;
Nathan Ip, Austin, TX (US);
Megan Wooley, Austin, TX (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
Sensitivity calculations are provided of a process model through the rate of change of a model fingerprint with respect to process variables and defects. A fingerprint sensitivity table is generated, where process variables are associated with a set of fingerprint sensitivities. The fingerprint of incoming substrates is monitored through a production process by applying the same fingerprint method that is used in the process model. Calculations are made of the difference between the incoming substrate fingerprint and the process model predicted fingerprint. This difference fingerprint is compared against the table of fingerprint sensitivities to find the process variable most likely to be responsible for the difference. Spatial relationships between process variables and actual measurements on the substrate may be obtained. Correlation through fingerprint sensitivity improves the ability to pinpoint faulty process tools. The difference fingerprint may also identify the formation of defects on a substrate.