The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Mar. 02, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Shuran Sheng, Saratoga, CA (US);

Lin Zhang, San Jose, CA (US);

Jiyong Huang, Rockwall, TX (US);

Joseph C. Werner, Santa Clara, CA (US);

Stanley Wu, San Ramon, CA (US);

Mahesh Adinath Kanawade, Santa Clara, CA (US);

Yikai Chen, San Jose, CA (US);

Yixing Lin, Saratoga, CA (US);

Ying Ma, Castro Valley, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C01F 17/265 (2020.01); C23C 16/458 (2006.01); C01F 17/229 (2020.01); C01F 17/218 (2020.01);
U.S. Cl.
CPC ...
C23C 16/4404 (2013.01); C01F 17/265 (2020.01); C23C 16/4405 (2013.01); C23C 16/4581 (2013.01); C23C 16/4585 (2013.01); C01F 17/218 (2020.01); C01F 17/229 (2020.01);
Abstract

Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.


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