The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Jun. 07, 2018
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Munehisa Kodama, Koshi, JP;
Takahiro Sakamoto, Koshi, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 7/22 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); H01L 21/66 (2006.01); B24B 7/04 (2006.01); B24B 49/02 (2006.01); B24B 49/12 (2006.01);
U.S. Cl.
CPC ...
B24B 7/228 (2013.01); B24B 7/04 (2013.01); B24B 49/02 (2013.01); B24B 49/12 (2013.01); H01L 21/304 (2013.01); H01L 21/6836 (2013.01); H01L 22/26 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A substrate processing method of thinning a substrate having a protective tape attached on a front surface thereof includes measuring a thickness of the protective tape; and grinding, by using a grinder, a rear surface of the substrate held by a substrate holder.