The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Nov. 21, 2020
Applicant:

Yangtze Memory Technologies Co., Ltd., Wuhan, CN;

Inventor:

Li Hong Xiao, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/27 (2023.01); G11C 16/04 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/792 (2006.01);
U.S. Cl.
CPC ...
H10B 43/27 (2023.02); G11C 16/0466 (2013.01); G11C 16/0483 (2013.01); H01L 29/42352 (2013.01); H01L 29/66833 (2013.01); H01L 29/7926 (2013.01);
Abstract

Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a method for forming a 3D memory device is disclosed. a memory stack including a plurality of interleaved gate conductive layers and gate-to-gate dielectric layers above a substrate is formed. Each of the gate-to-gate dielectric layers includes a silicon nitride layer. A NAND memory string extending vertically through the interleaved gate conductive layers and gate-to-gate dielectric layers of the memory stack is formed. A slit structure extending vertically through the interleaved gate conductive layers and gate-to-gate dielectric layers of the memory stack is formed.


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