The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Nov. 01, 2022
Applicant:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Inventors:
Milind S. Bhagavat, Broomfield, CO (US);
Rahul Agarwal, Livermore, CA (US);
Assignee:
ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/49838 (2013.01); H05K 1/0231 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10636 (2013.01);
Abstract
Various circuit boards with mounted passive components and method of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes at least partially encapsulating a first plurality of passive components in a molding material to create a first molded passive component group. The first molded passive component group is mounted on a surface of a circuit board. The first plurality of passive components are electrically connected to the circuit board.