The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

May. 25, 2021
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Jie Bai, Hefei, CN;

Kang You, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823857 (2013.01); H01L 21/28185 (2013.01);
Abstract

The present application relates to a semiconductor device and a manufacturing method thereof. The method includes: obtaining a substrate, a first device region, a second device region and a high-k gate dielectric layer film being formed on the substrate; forming, on the substrate, a barrier layer structure covering the high-k gate dielectric layer film at the second device region; forming a covering layer film including a first metal element on the substrate; and diffusing the first metal element in the covering layer film towards the high-k gate dielectric layer film at the first device region using an annealing process, the barrier layer structure preventing the first metal element from being diffused towards the high-k gate dielectric layer film at the second device region; wherein the first device region and the second device region have opposite conduction types.


Find Patent Forward Citations

Loading…