The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Mar. 26, 2021
Applied Materials, Inc., Santa Clara, CA (US);
Amirhasan Nourbakhsh, Albany, NY (US);
Lan Yu, Albany, NY (US);
Joseph F. Salfelder, Pleasant Valley, NY (US);
Ki Cheol Ahn, Watervliet, NY (US);
Tyler Sherwood, Fonda, NY (US);
Siddarth Krishnan, San Jose, CA (US);
Michael Jason Fronckowiak, Troy, NY (US);
Xing Chen, Dublin, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Exemplary methods of processing a semiconductor substrate may include forming a layer of dielectric material on the semiconductor substrate. The methods may include performing an edge exclusion removal of the layer of dielectric material. The methods may include forming a mask material on the semiconductor substrate. The mask material may contact the dielectric material at an edge region of the semiconductor substrate. The methods may include patterning an opening in the mask material overlying a first surface of the semiconductor substrate. The methods may include etching one or more trenches through the semiconductor substrate.