The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Aug. 28, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventor:

Harsh Narendrakumar Jain, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H10B 41/27 (2023.01); H10B 41/35 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01);
U.S. Cl.
CPC ...
H01L 23/53295 (2013.01); H01L 21/76831 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H10B 41/27 (2023.02); H10B 41/35 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02);
Abstract

A microelectronic device comprises a first deck structure comprising alternating conductive structures and insulating structures arranged in tiers, each of the tiers individually comprising one of the conductive structures and one of the insulating structures, a second deck structure vertically overlying the first deck structure and comprising additional tiers of the conductive structures and insulative structures, a staircase structure within the first deck structure and having steps comprising edges of the tiers, a dielectric material covering the steps of the staircase structure and extending through the first deck structure, and a liner material interposed between the steps of the staircase structure and terminating at an interdeck region between the first deck structure and the second deck structure. Related microelectronic devices, electronic systems, and methods are also described.


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