The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Oct. 27, 2021
Applicants:

Advantest Corporation, Tokyo, JP;

Toei Scientific Industrial Co., Ltd., Sendai, JP;

Inventors:

Naoyoshi Watanabe, Tokyo, JP;

Shigeyuki Sato, Sendai, JP;

Ryoichi Utsumi, Sendai, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 33/02 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2889 (2013.01); G01R 31/2863 (2013.01); G01R 33/02 (2013.01);
Abstract

The test apparatus tests a wafer under test on which devices under test each including magnetoresistive memory or a magnetic sensor are formed. In a test process, the wafer under test is mounted on a stage. A test probe card is configured such that it can make probe contact with the wafer under test in the test process. A wafer connection HiFix is arranged between the test probe card and a test head. A magnetic field application apparatus is provided to the wafer connection HiFix. In the test process, the magnetic field application apparatus applies a magnetic field Bto the wafer under test.


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