The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Jul. 13, 2021
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Jun He, Hefei, CN;

Jie Liu, Hefei, CN;

Changhao Quan, Hefei, CN;

Zhan Ying, Hefei, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/26 (2006.01); B29C 45/14 (2006.01); B29C 45/72 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/2602 (2013.01); B29C 45/14344 (2013.01); B29C 45/72 (2013.01); B29L 2031/34 (2013.01);
Abstract

An injection mould and an injection moulding method are provided. The injection mould includes a base plate used to place a packaged chip to be injection moulded including a substrate and at least one of the chips fixed on the front substrate by a flip chip process. The substrate has a gas hole. Two or more gas ducts that extend in at least two intersected directions and connect with one another are formed in the base plate. Two ends of each one of gas ducts are open, and at least one of the gas ducts is buried into the base plate. Each one of gas ducts is provided with a gas outlet. When the packaged chip is placed on the base plate, the gas outlet connects with the gas hole of the substrate.


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