The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Jul. 23, 2021
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Yusheng Lin, Phoenix, AZ (US);
Jerome Teysseyre, Scottsdale, AZ (US);
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01); H01L 23/051 (2006.01); H01L 25/18 (2023.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 21/52 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/4334 (2013.01); H01L 23/49822 (2013.01); H01L 24/20 (2013.01); H01L 25/0657 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 29/7393 (2013.01); H01L 29/861 (2013.01); H01L 2225/06589 (2013.01);
Abstract
A method includes disposing a semiconductor die between a first high voltage isolation carrier and a second high voltage isolation carrier, disposing a first molding material in a space between the semiconductor die and the first high voltage isolation carrier, and disposing a conductive spacer between the semiconductor die and the second high voltage isolation carrier. The method further includes encapsulating the first molding material and the conductive spacer with a second molding material.