The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Nov. 05, 2020
Intel Corporation, Santa Clara, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A chip assembly may include a package substrate that includes one or more pins. The chip assembly may also include one or more pads. The one or more pads may be electrically coupled to the one or more pins. In addition, the chip assembly may include a board that includes one or more board pads. Further, the chip assembly may include an anisotropic layer. The anisotropic layer may be positioned between the board and the one or more pads and between the board and a portion of the package substrate. In addition, the anisotropic layer may mechanically couple the board to the one or more pads and to the portion of the package substrate. Further, the anisotropic layer may electrically couple the one or more pads to the one or more board pads.