The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

May. 26, 2021
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Chih-Tung Yeh, Taoyuan, TW;

Chun-Liang Hou, Hsinchu County, TW;

Wen-Jung Liao, Hsinchu, TW;

Ruey-Chyr Lee, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/778 (2006.01); H01L 29/66 (2006.01); H01L 29/205 (2006.01); H01L 29/45 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7783 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/401 (2013.01); H01L 29/454 (2013.01); H01L 29/66462 (2013.01);
Abstract

A semiconductor transistor structure with reduced contact resistance includes a substrate, a channel layer on the substrate, a barrier layer on the channel layer, a two-dimensional electron gas (2DEG) layer at an interface between the barrier layer and the channel layer, and a recess in a contact region. The recess penetrates through the barrier layer and extends into the channel layer. An Ohmic contact metal is disposed in the recess. The Ohmic contact metal is in direct contact with a vertical side surface of the barrier layer in the recess and in direct contact with an inclined side surface of the 2DEG layer and the channel layer in the recess.


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