The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
May. 11, 2021
Applied Materials, Inc., Santa Clara, CA (US);
Kun Xu, Sunol, CA (US);
Kiran Lall Shrestha, San Jose, CA (US);
Doyle E. Bennett, Santa Clara, CA (US);
David Maxwell Gage, Sunnyvale, CA (US);
Benjamin Cherian, San Jose, CA (US);
Jun Qian, Sunnyvale, CA (US);
Harry Q. Lee, Los Altos, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.