The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Jun. 06, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yasuaki Noda, Koshi, JP;

Tadashi Nishiyama, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01N 21/95 (2006.01); B05D 1/00 (2006.01); H01L 21/027 (2006.01); H01L 21/68 (2006.01); G06T 7/00 (2017.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/00 (2006.01); G03F 7/26 (2006.01); G06T 7/60 (2017.01); H01L 21/687 (2006.01); H01L 21/66 (2006.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0274 (2013.01); B05D 1/005 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/2028 (2013.01); G03F 7/26 (2013.01); G03F 7/70425 (2013.01); G06T 7/0008 (2013.01); G06T 7/60 (2013.01); H01L 21/6715 (2013.01); H01L 21/67173 (2013.01); H01L 21/67253 (2013.01); H01L 21/67288 (2013.01); H01L 21/681 (2013.01); H01L 21/68714 (2013.01); H01L 22/20 (2013.01); G01N 21/8806 (2013.01); G01N 21/9501 (2013.01); G01N 21/9503 (2013.01); G06T 2207/30148 (2013.01); H01L 22/12 (2013.01);
Abstract

A processing method in one embodiment includes: a step that takes an image of the end face of a reference substrate, whose warp amount is known, over the whole periphery thereof using a camera to obtain shape data of the end face of the reference substrate; a step that takes an image of the end face of a substrate over the whole periphery thereof using a camera to obtain shape data of the end face of the substrate; a step that calculates warp amount of the substrate based on the obtained shape data; a step that forms a resist film on a surface of the substrate; a step that determines the supply position from which an organic solvent is to be supplied to a peripheral portion of the resist film and dissolves the peripheral portion by the solvent supplied from the supply position to remove the same from the substrate.


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