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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11784070 B1

PDFFull Text
Date of Patent:
Oct. 10, 2023

Filed:

Apr. 18, 2020

Heat treatment apparatus, heat treatment method, and film forming method

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yasuaki Kikuchi, Iwate, JP;

Tatsuya Yamaguchi, Iwate, JP;

Kazuteru Obara, Iwate, JP;

Ryuji Kusajima, Miyagi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Venjuris, P.C.

Primary Examiner:

Jeffrie R Lund

Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 16/46 (2006.01); C23C 16/34 (2006.01); C23C 16/52 (2006.01); H01L 21/02 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); C23C 16/345 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02269 (2013.01); H01L 21/67109 (2013.01); H01L 21/67303 (2013.01);
Abstract

A heat treatment apparatus includes: an inner tube having a cylindrical shape and configured to accommodate a substrate; an outer tube configured to cover an outside of the inner tube; a heater provided around the outer tube; a gas supply pipe that extends along a longitudinal direction in the inner tube; an opening formed in a side wall of the inner tube facing the gas supply pipe; a temperature sensor provided at a position shifted by a predetermined angle from the opening in a circumferential direction of the inner tube; and a controller that controls the heater based on a detected value of the temperature sensor.

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Kikuchi, Yasuaki. (2023). Heat treatment apparatus, heat treatment method, and film forming method (U.S. Patent No. 11784070). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11784070

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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