The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Dec. 15, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Anthony R. Schepis, Averill Park, NY (US);

Anton deVilliers, Clifton Park, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B05D 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02282 (2013.01); H01L 21/02134 (2013.01); B05D 1/005 (2013.01);
Abstract

A method for planarizing a substrate includes: receiving a substrate having microfabricated structures that differ in height across the working surface of the substrate that define a non-planar topography, depositing a first layer that includes a solubility-shifting agent on the working surface of the substrate by spin-on deposition in a non-planar fashion, exposing the first layer to a first pattern of actinic radiation based on the topography, developing the first layer using a predetermined solvent, and depositing a second layer over the working surface of the substrate that has a greater planarity as compared to the first layer prior to developing the first layer. The first pattern of radiation changes a solubility of the first layer such that upper regions of the non-planar topography of the first layer are soluble to the predetermined solvent.


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