The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Oct. 14, 2021
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Inventors:

Hakki Ergün Cekli, Singapore, SG;

Masashi Ishibashi, Eindhoven, NL;

Wendy Johanna Martina Van De Ven, Heesch, NL;

Willem Seine Christian Roelofs, Deurne, NL;

Elliott Gerard McNamara, Eindhoven, NL;

Rizvi Rahman, Bundang-Gu, KR;

Michiel Kupers, Roermond, NL;

Emil Peter Schmitt-Weaver, Eindhoven, NL;

Erik Henri Adriaan Delvigne, Breda, NL;

Assignee:

ASML NETHERLANDS B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 7/00 (2006.01); G01N 21/956 (2006.01); G03F 9/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G01N 21/956 (2013.01); G03F 9/7046 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01);
Abstract

Measurements are obtained from locations across a substrate before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of a performance parameter such as overlay, after a pattern has been applied. A set of measurement locations is selected from among all possible measurement locations. At least a subset of the selected measurement locations are selected dynamically, in response to measurements obtained using a preliminary selection of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect, outlier measurements are detected based on supplementary data such as height measurements or historic data.


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