The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Feb. 12, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Melvin Verbaas, Yamanashi, JP;

Kentaro Asakura, Yamanashi, JP;

Takashi Mochizuki, Yamanashi, JP;

Takahisa Mase, Yamanashi, JP;

Nobutaka Yoshioka, Yamanashi, JP;

Saki Matsuo, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01K 7/02 (2021.01); H05B 3/26 (2006.01); H05B 3/14 (2006.01); G01K 1/08 (2021.01); H01L 21/67 (2006.01); G01K 1/14 (2021.01); G01K 1/16 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
G01K 7/02 (2013.01); G01K 1/08 (2013.01); G01K 1/14 (2013.01); G01K 1/16 (2013.01); H01L 21/67098 (2013.01); H05B 3/141 (2013.01); H05B 3/265 (2013.01); H01L 21/67103 (2013.01); H01L 21/68785 (2013.01);
Abstract

Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.


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