The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Oct. 28, 2022
Applicant:
Zhuhai Access Semiconductor Co., Ltd, Zhuhai, CN;
Inventors:
Assignee:
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD, Guangdong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/50 (2006.01); H01L 21/768 (2006.01); H01L 23/15 (2006.01); H01L 23/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/50 (2013.01); H01L 21/76802 (2013.01); H01L 23/15 (2013.01); H01L 24/14 (2013.01); H01L 21/60 (2021.08);
Abstract
A package substrate includes: a glass frame having a through hole and a chip embedding cavity; an electronic component arranged in the chip embedding cavity; a dielectric layer filled on an upper surface of the glass frame and in the chip embedding cavity; a metal pillar passing through the through hole; a circuit layer arranged on the upper surface and/or a lower surface of the glass frame and connected to the electronic component and the metal pillar; and a solder mask arranged on a surface of the circuit layer and having a pad which is connected to the circuit layer.